Section I: High-performance compound semiconductor devices and applications Chapter 1: III-V compound semiconductor transistors - from planar to nanowire structures Chapter 2: UTB III-V-OI-Si MOS transistor: the future transistor for VLSI design Chapter 3: Assessment of SiGe/Si heterojunction tunnel field-effect transistor for digital VLSI circuit applications Chapter 4: Simulation framework for GaN devices with special mention to reliability concern Section II: Process variability in FinFETs: challenges and mitigation Chapter 5: Impact of oxide thickness variation on the performance of junctionless FinFET Chapter 6: Design and analysis of variability aware FinFET-based SRAM circuit design Section III: Through silicon via interconnects for three-dimensional integration Chapter 7: Modelling interconnects for future VLSI circuit applications Chapter 8: Nanomagnetic computing for next generation interconnects and logic design Chapter 9: Prospective current mode approach for on-chip interconnects in integrated circuit designs Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core Section III: Through silicon via interconnects for three-dimensional integration Chapter 7: Modelling interconnects for future VLSI circuit applications Chapter 8: Nanomagnetic computing for next generation interconnects and logic design Chapter 9: Prospective current mode approach for on-chip interconnects in integrated circuit designs Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core Section III: Through silicon via interconnects for three-dimensional integration Chapter 7: Modelling interconnects for future VLSI circuit applications Chapter 8: Nanomagnetic computing for next generation interconnects and logic design Chapter 9: Prospective current mode approach for on-chip interconnects in integrated circuit designs Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core Section III: Through silicon via interconnects for three-dimensional integration Chapter 7: Modelling interconnects for future VLSI circuit applications Chapter 8: Nanomagnetic computing for next generation interconnects and logic design Chapter 9: Prospective current mode approach for on-chip interconnects in integrated circuit designs Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core Section III: Through silicon via interconnects for three-dimensional integration Chapter 7: Modelling interconnects for future VLSI circuit applications Chapter 8: Nanomagnetic computing for next generation interconnects and logic design Chapter 9: Prospective current mode approach for on-chip interconnects in integrated circuit designs Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core Chapter 10: Design of through silicon vias for improved performance in 3D IC applications Chapter 11: Prospective graphene-based through silicon vias in three-dimensional integrated circuits Section IV: Emerging technologies for integrated circuits Chapter 12: Radiation hard circuit design: flip-flop and SRAM Chapter 13: Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core nge memory: electrical circuit modelling, nanocrossbar performance analysis and applications Chapter 14: Methods to design ternary gates and adders Chapter 15: Single EXCCII based square/triangular wave generator for capacitive sensor interfacing and brief review Chapter 16: Transient fault secured/tolerant architecture for DSP core.