Preface 1 Introduction to Electromagnetic Compatibility (EMC) 1.1 Aspects of EMC 1.2 Electrical Dimensions and Waves 1.3 Decibels and Common EMC Units 1.3.1 Signal Source Specification Problems References 2 EMC Requirements for Electronic Systems 2.1 Governmental Requirements 2.1.
1 Requirements for Commercial Products Marketed in the United States 2.1.2 Requirements for Commercial Products Marketed outside the United States 2.1.3 Requirements for Military Products Marketed in the United States 2.1.4 Measurement of Emissions for Verification of Compliance 2.1.
4.1 Radiated Emissions 2.1.4.2 Conducted Emissions 2.1.5 Typical Product Emissions 2.1.
6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits 2.2 Additional Product Requirements 2.2.1 Radiated Susceptibility (Immunity) 2.2.2 Conducted Susceptibility (Immunity) 2.2.3 Electrostatic Discharge (ESD) 2.
2.4 Requirements for Commercial Aircraft 2.2.5 Requirements for Commercial Vehicles 2.3 Design Constraints for Products 2.4 Advantages of EMC Design Problems References 3 Signal Spectra--the Relationship between the Time Domain and the Frequency Domain 3.1 Periodic Signals 3.1.
1 The Fourier Series Representation of Periodic Signals 3.1.2 Response of Linear Systems to Periodic Input Signals 3.1.3 Important Computational Techniques 3.2 Spectra of Digital Waveforms 3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms 3.
2.2 Spectral Bounds for Trapezoidal Waveforms 3.2.2.1 Effect of Rise/Falltime on Spectral Content 3.2.2.2 Bandwidth of Digital Waveforms 3.
2.2.3 Effect of Repetition Rate and Duty Cycle 3.2.2.4 Effect of Ringing (Undershoot/Overshoot) 3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System 3.
3 Spectrum Analyzers 3.3.1 Basic Principles 3.3.2 Peak versus Quasi-Peak versus Average 3.4 Representation of Nonperiodic Waveforms 3.4.1 The Fourier Transform 3.
4.2 Response of Linear Systems to Nonperiodic Inputs 3.5 Representation of Random (Data) Signals Problems References 4 Transmission Lines and Signal Integrity 4.1 The Transmission-Line Equations 4.2 The Per-Unit-Length Parameters 4.2.1 Wire-Type Structures 4.2.
2 Printed Circuit Board (PCB) Structures 4.3 The Time-Domain Solution 4.3.1 Graphical Solutions 4.3.2 The Branin Method 4.4 High-Speed Digital Interconnects and Signal Integrity 4.4.
1 Effect of Terminations on the Line Waveforms 4.4.1.1 Effect of Capacitive Terminations 4.4.1.2 Effect of Inductive Terminations 4.4.
2 Matching Schemes for Signal Integrity 4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required? 4.4.4 Effects of Line Discontinuities 4.5 Sinusoidal Excitation of the Line and the Phasor Solution 4.
5.1 Voltage and Current as Functions of Position 4.5.2 Power Flow 4.5.3 Inclusion of Losses 4.5.4 Effect of Losses on Signal Integrity 4.
6 Lumped-Circuit Approximate Models Problems References 5 Nonideal Behavior of Components 5.1 Wires 5.1.1 Resistance and Internal Inductance of Wires 5.1.2 External Inductance and Capacitance of Parallel Wires 5.1.3 Lumped Equivalent Circuits of Parallel Wires 5.
2 Printed Circuit Board (PCB) Lands 5.3 Effect of Component Leads 5.4 Resistors 5.5 Capacitors 5.6 Inductors 5.7 Ferromagnetic Materials--Saturation and Frequency Response 5.8 Ferrite Beads 5.9 Common-Mode Chokes 5.
10 Electromechanical Devices 5.10.1 DC Motors 5.10.2 Stepper Motors 5.10.3 AC Motors 5.10.
4 Solenoids 5.11 Digital Circuit Devices 5.12 Effect of Component Variability 5.13 Mechanical Switches 5.13.1 Arcing at Switch Contacts 5.13.2 The Showering Arc 5.
13.3 Arc Suppression Problems References 6 Conducted Emissions and Susceptibility 6.1 Measurement of Conducted Emissions 6.1.1 The Line Impedance Stabilization Network (LISN) 6.1.2 Common- and Differential-Mode Currents Again 6.2 Power Supply Filters 6.
2.1 Basic Properties of Filters 6.2.2 A Generic Power Supply Filter Topology 6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents 6.2.4 Separation of Conducted Emissions into Common and Differential-Mode Components for Diagnostic Purposes 6.
3 Power Supplies 6.3.1 Linear Power Supplies 6.3.2 Switched-Mode Power Supplies (SMPS) 6.3.3 Effect of Power Supply Components on Conducted Emissions 6.4 Power Supply and Filter Placement 6.
5 Conducted Susceptibility Problems References 7 Antennas 7.1 Elemental Dipole Antennas 7.1.1 The Electric (Hertzian) Dipole 7.1.2 The Magnetic Dipole (Loop) 7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 7.3 Antenna Arrays 7.
4 Characterization of Antennas 7.4.1 Directivity and Gain 7.4.2 Effective Aperture 7.4.3 Antenna Factor 7.4.
4 Effects of Balancing and Baluns 7.4.5 Impedance Matching and the Use of Pads 7.5 The Friis Transmission Equation 7.6 Effects of Reflections 7.6.1 The Method of Images 7.6.
2 Normal Incidence of Uniform Plane Waves on Plane Material Boundaries 7.6.3 Multipath Effects 7.7 Broadband Measurement Antennas 7.7.1 The Biconical Antenna 7.7.2 The Log-Periodic Antenna 7.
8 Antenna Modeling and Simulation 7.8.1 Why Model Antennas? 7.8.2 Modeling Methods 7.8.3 Summary Problems References 8 Radiated Emissions and Susceptibility 8.1 Simple Emission Models for Wires and PCB Lands 8.
1.1 Differential-Mode versus Common-Mode Currents 8.1.2 Differential-Mode Current Emission Model 8.1.3 Common-Mode Current Emission Model 8.1.4 Current Probes 8.
1.5 Experimental Results 8.2 Simple Susceptibility Models for Wires and PCB Lands 8.2.1 Experimental Results 8.2.2 Shielded Cables and Surface Transfer Impedance Problems References 9 Crosstalk 9.1 Three-Conductor Transmission Lines and Crosstalk 9.
2 The Transmission-Line Equations for Lossless Lines 9.3 The Per-Unit-Length Parameters 9.3.1 Homogeneous versus Inhomogeneous Media 9.3.2 Wide-Separation Approximations for Wires 9.3.3 Numerical Methods for Other Structures 9.
3.3.1 Wires with Dielectric Insulations (Ribbon Cables) 9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands) 9.4 The Inductive-Capacitive Coupling Approximate Model 9.4.
1 Frequency-Domain Inductive-Capacitive Coupling Model 9.4.1.1 Inclusion of Losses: Common-Impedance Coupling 9.4.1.2 Experimental Results 9.4.
2 Time-Domain Inductive-Capacitive Coupling Model 9.4.2.1 Inclusion of Losses: Common-Impedance Coupling 9.4.2.2 Experimental Results 9.5 Shielded Wires 9.
5.1 Per-Unit-Length Parameters 9.5.2 Inductive and Capacitive Coupling 9.5.3 Effect of Shield Grounding 9.5.4 Effect of Pigtails 9.
5.5 Effects of Multiple Shields 9.5.6 MTL Model Predictions 9.6 Twisted Wires 9.6.1 Per-Unit-Length Parameters 9.6.
2 Inductive and Capacitive Coupling 9.6.3 Effects of Twist 9.6.4 Effects of Balancing Problems References 10 Shielding 10.1 Shielding Effectiveness 10.2 Shielding Effectiveness: Far-Field Sources 10.2.
1 Exact Solution 10.2.2 Approximate Solution 10.2.2.1 Reflection Loss 10.2.2.
2 Absorption Loss 10.2.2.3 Multiple-Reflection Loss 10.2.2.4 Total Loss 10.3 Shielding Effectiveness: Near-Field Sources 10.
3.1 Near Field versus Far Field 10.3.2 Electric Sources 10.3.3 Magnetic Sources 10.4 Low-Frequency, Magnetic Field Shielding 10.5 Effect of Apertures Problems References 11 System Design for EMC 11.
1 Changing the Way We Think about Electrical Phenomena 11.1.1 Nonideal Behavior of Components and the Hidden Schematic 11.1.2 "Electrons Do Not Read Schematics" 11.1.3 What Do We Mean by the Term "Shielding"? 11.2 What Do We Mean by the Term "Ground"? 11.
2.1 Safety Ground 11.2.2 Signal Ground 11.2.3 Ground Bounce and Partial Inductance 11.2.3.
1 Partial Inductance of Wires 11.2.3.2 Partial Inductance of PCB Lands 11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance 11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path 11.
2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding 11.2.7 Ground Loops and Subsystem Decoupling 11.3 Printed Circuit Board (PCB) Design 11.3.1 Component Selection 11.3.
2 Component Speed and Placement 11.3.3 Cable I / O Placement and Filtering 11.3.4 The Important Ground Grid 11.3.5 Power Distribution and Decoupling Capacitors 11.3.
6 Reduction of Loop Areas 1.