Basics of Microjoining Mechanisms of Solid-State Bonding, J.E. Gould - Introduction - Mechanisms of solid-state bonding - Contaminant displacement/interatomic bonding - Extension of the contacting surfaces - Separation of the contaminated areas - Realignment of the grain structures for bonding - Breakdown of the interfacial structure - Summary - References Mechanisms of Soldering and Brazing, T. Takemoto - Introduction - Definition of soldering and brazing - Basic metallurgical reaction during soldering and brazing - Materials for solders and brazing - Soldering and brazing process - Summary and future trends Mechanisms of Fusion Microwelding, G.A. Knorovsky and VV. Semak - Introduction - Fundamental aspects - Forces acting on the pool - Practical aspects - Some problems in applying micro fusion joining - Examples: laser, arc and resistance welding - Summary and conclusions - Acknowledgements - References Modelling of Solid-State Bonding, Y. Takahashi - Introduction - Viscoplastic deformation model and interfacial deformation - Thermocompression bonding - Thermosonic bonding - Numerical simulation of lap resistance welding - Conclusive remarks - References Modelling of Fusion Microwelding,B.
Chang - Introduction - Features of thermal process in fusion microwelding - Modelling of conductive heat transfer - Modelling of convective heat transfer - Modelling of resistance microwelding - Summary and future trends - Acknowledgements - References Sensing, Monitoring and Control, M. Mayer - Introduction - Definitions and methods - Signals from joining processes - Applications - Future trends - References Assembly Process Automation and Materials Handling, Y.M. Cheung and D. Liu - Introduction - Assembly equipments for in-line process - Material handling in assembly equipment - Control of process parameters for assembly processes - Case study: design a customized assembly equipment - an alignment laser welder for fibre pigtailed TO-can laser diode package - Future trends - References Microjoining and Nanojoining Processes Microelectronics Wire Bonding, I. Lum, M. Mayer and Y. Zhou - Introduction - Wire bonding process - Process parameters - Mechanisms of bond formation - Quality control - Equipment and fixturing - Current directions - References Solid-State Diffusion Bonding, A.
Shirzadi - Basic definition - Solid-state bonding in comparison with other joining methods - Main bonding parameters and apparatus - Theoretical aspects and modelling of solid-state diffusion bonding - Various approaches to overcome surface oxide problem - Non-chemical surface oxide removal using liquid gallium - Summary Bonding Using Nanoparticles, A. Hirose and K.F. Kobayashi - Introduction - Structure and thermal characteristics of composite Ag nanoparticle - Bonding of various metals using composite Ag nanoparticle - Effects of bonding conditions on bondability of Cu-to-Cu joints - Bonding of Si chip - Conclusion and future trends - References Diffusion Soldering and Brazing, M.L. Kuntz and Y. Zhou - Introduction to diffusion soldering/brazing - Process description of diffusion soldering/brazing - Diffusion soldering/brazing process mechanics - Evaluating joint properties - Modeling of diffusion soldering/brazing - Summary and future trends - References Laser Soldering, Y. Tian - Introduction - Overview of laser soldering - Fundamentals of laser soldering - Fluxless laser soldering - Reliability of solder joint - Summary and future trends - Acknowledgment - References Fluxless Soldering, J.
P. Jung and S.M. Hong - Flux in Soldering - Demand for fluxless soldering - Fluxless soldering process - Summary Laser Microwelding, I. Miyamoto and G A Knorovsky - Introduction - Fundamentals of laser micro welding - Thermal modeling of laser microwelding - Weld defects - Laser microwelding technologies - Evaluation of micro weld joints - Applications of laser microwelding - Novel laser microwelding technologies - Future trends - Acknowledgements - Bibliography - Equation annex Electron Beam Microwelding, G.A. Knorovsky, T. Dorfmüller, U.
Dilthey, and K. Woeste - Introduction - Technology - Microwelding process - Examples of joining and applications - Summary - Acknowledgements - References Resistance Microwelding, S. Fukumoto, Y Zhou, and W Tan - Introduction - Fundamentals - Process variations - Process conditions: Welding parameters - Process conditions: Surface - Dynamic resistance and process control - Equipment - Summary and future trends - References Adhesive Bonding, I.S. Böhm, E. Stammen, G. Hemken, and M. Wagner - Introduction - Adhesive bonding as joining technology - Adhesive bonding process: pre treatment - Dispensing and mixing of adhesives - Curing and setting of adhesives - Quality control - Principles of adhesive selection and examples of applications - Microelectronic interconnections and packaging - Other applications of adhesive bonding - Future trends - Appendix - References Introduction to Nanojoining, S.
Sahin, M. Yavuz, and Y.N. Zhou - Introduction - Nano-joining methods - Joining by electron beam nano-welding - Joining by resistance nano-welding - Joining by ultrasonic nano-welding - Joining by laser nano-welding - Summary & future trends - References Microjoining of Materials and Applications of Microjoining Joining of High Temperature Superconductors, G. Zou - Introduction - Superconducting materials - Processing technologies of high temperature superconductors - Needs for joining high temperature superconductors - Joining of BSCCO bulks - Soldering of BSCCO tapes - Diffusion bonding of BSCCO tapes - Joining of YBCO bulks - Conclusion and future trends - Acknowledgements - References Joining of Shape Memory Alloys, K. Uenishi and K.F. Kobayashi - Introduction - Basics of shape memory alloys - Application of SMAs - Background on welding and laser processing of SMA - Brazing of nithinol - Laser microwelding - Future trends - References Wafer Bonding, J.
Wei and Z. Sun - Introduction - Direct wafer bonding - Anodic wafer bonding - Wafer bonding via intermediate layers - Bonding of dissimilar materials - Concluding remarks - References Plastics Microwelding, I. Jones - Introduction - Theory of welding plastics - Introduction to welding processes - Introduction to processes for microwelding of plastics - Ultrasonic welding - Laser welding - Future trends - References Microjoining in Medical Components and Devices, K.J. Ely and Y.N. Zhou - Introduction - Materials challenges - Medical components and devices - Joint design and process selection - Testing and verification - Summary and future trends - References Hermetic Sealing of Solid Oxide Fuel Cells, M. Brochu and R.
E. Loehman - Introduction - Materials involv.