NAPL Removal Surfactants, Foams, and Microemulsions
NAPL Removal Surfactants, Foams, and Microemulsions
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Author(s): Ward, C. H.
ISBN No.: 9781566704670
Pages: 560
Year: 200005
Format: Trade Cloth (Hard Cover)
Price: $ 196.10
Dispatch delay: Dispatched between 7 to 15 days
Status: Available

Demonstration of the Surfactant/Foam Process for Remediation of a Heterogeneous Aquifer Contaminated with DNAPL Executive Summary Description of Surfactant/Foam Process and Surfactant-Enhanced Aquifer Remediation Surfactant/Foam Process Development Surfactant/Foam Field Site Description Field Demonstration Design Field Operations Field Monitoring, Sampling, and Analytical Methods Results Discussion Conclusions References for Surfactant/Foam Demonstration of Single-Phase Microemulsions for Aquifer Remediation Executive Summary Introduction Single-Phase Microemulsion (SPME) In Situ Flushing: Background Phase I: Laboratory Investigation Phase II: Field Investigation Conclusions References for SPME Design and Evaluation of Surfactant/Foam and Single-Phase Microemulsion Technologies Design of a Hypothetical Full-Scale Implementation of the Surfactant/Foam Process Executive Summary Summary of Technology Demonstration Measurement Procedures Engineering Design Cost and Economic Analysis Performance and Potential Application References Design and Evaluation of a Full-Scale Implementation of the Single-Phase Microemulsion Process Executive Summary Summary of SPME Demonstration Measurement Procedures Engineering Design Cost and Economic Analysis Performance and Potential Application References AppendicesFull-Scale Implementation of the Surfactant/Foam Process Executive Summary Summary of Technology Demonstration Measurement Procedures Engineering Design Cost and Economic Analysis Performance and Potential Application References Design and Evaluation of a Full-Scale Implementation of the Single-Phase Microemulsion Process Executive Summary Summary of SPME Demonstration Measurement Procedures Engineering Design Cost and Economic Analysis Performance and Potential Application References Appendices.


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