Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

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Author(s):	Kilic, Bahattin Madenci, Erdogan
ISBN No.:	9781402073304
Pages:	xx, 185
Year:	200212
Format:	Trade Cloth (Hard Cover)
Price:	$ 275.99
Dispatch delay:	Dispatched between 7 to 15 days
Status:	Available

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Synopsis
Table of contents
Full Details

Preface. List of Commands. List of Tables. List of Figures. 1: Introduction. 1.1. Numerical Modeling with Finite Element Analysis.

1.2. Constitutive Relations. 1.3. Failure Prediction. 1.4.

References. 2: Thermomechanical Fatigue Life Prediction Analysis. 2.1. Approach. 2.2. Analysis Steps.

2.3. Case Study: BGA-Type Package. 2.4. References. 3: Mechanical Bending Fatigue Life Prediction Analysis. 3.

1. Approach. 3.2. Analysis Steps. 3.3. Case Study: BGA-Type Package.

3.4. References. 4: Macro Reference Library. 4.1. Overview. 4.

2. Preprocessor. 4.3. Solution. 4.4. Postprocessing.

4.5. References. Appendix A: Installation and Execution. A.1: Steps for ReliANS Installation on a PC Platform. A.2: Steps for Adding Working Directories for Use in ReliANS.

A.3: Demonstration of ReliANS Installation and Adding New Directories. A.4: Installation of ReliANS on UNIX Systems. Appendix B: Input Listings for Case Studies. B.1: Input Listing for the Case Study Given in Chapter 2. B.

2: Input Listing for the Case Study Given in Chapter 3. Index.

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