Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing and Software Development
Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing and Software Development
Click to enlarge
Author(s): Kuo, Way
ISBN No.: 9780792381075
Pages: xxvi, 394
Year: 199801
Format: Trade Cloth (Hard Cover)
Price: $ 228.41
Dispatch delay: Dispatched between 7 to 15 days
Status: Available

1 Overview of Design, Manufacture, and Reliability.- 1.1 Production and Manufacturing Issues.- 1.2 Taguchi Method in Quality Engineering.- 1.3 Manufacturing Design and Reliability.- 1.


4 Reliability Standards.- 1.5 Conclusions.- 2 Integrating Reliability into Microelectronics Manufacturing.- 2.1 Microelectronics Manufacturing.- 2.2 New Techniques for Reliability Improvement.


- 2.3 Manufacturing Yield and Reliability.- 2.4 Conclusions.- 3 Basic Reliability Concept.- 3.1 Elements of Reliability.- 3.


2 Some Useful Life Distributions.- 3.3 Strength and Stress Analysis.- 3.4 Multicomponents Systems.- 3.5 Conclusions.- 4 Yield and Modeling Yield.


- 4.1 Definitions and Concept.- 4.2 Yield Models.- 4.3 Yield Prediction.- 4.4 Yield Estimation.


- 4.5 Fault Coverage and Occurrence.- 4.6 Yield-reliability Relation Model.- 4.7 Cost Model.- 4.8 Conclusions.


- 5 Reliability Stress Tests.- 5.1 Accelerated Life Tests.- 5.2 Environmental Stress Screening (ESS).- 5.3 Failures and Reliability Prediction.- 5.


4 Conclusions.- 6 Burn-in Performance, Cost, and Statistical Analysis.- 6.1 Design of Burn-in.- 6.2 Performance and Cost Modeling.- 6.3 Burn-in Optimization.


- 6.4 Statistical Approaches for Burn-in Analysis.- 6.5 Conclusions.- 7 Nonparametric Reliability Analysis.- 7.1 The Proportional Hazard Rate Model.- 7.


2 The Life Table Estimator (LTE).- 7.3 The Kaplan-Meier Product Limits Estimator.- 7.4 Goodness-of-fit (GOF) Tests.- 7.5 Smoothing Techniques.- 7.


6 Conclusions.- 8 Parametric Approaches To Decide Optimal System Burn-in Time.- 8.1 A Time-independent Model.- 8.2 A Time-dependent Model.- 8.3 Conclusions.


- 9 Nonparametric Approach and Its Applications to Burn-in.- 9.1 Introduction.- 9.2 Methods.- 9.3 Applications.- 9.


4 Conclusions.- 10 Nonparametric Bayesian Approach for Optimal Burn-in.- 10.1The Dirichlet Distribution.- 10.2 The Model Formulation.- 10.3 Other Considerations.


- 10.4 Conclusions.- 11 The Dirichlet Process for Reliability Analysis.- 11.1 Method.- 11.2 Variance Reduction in the Dirichlet Process.- 11.


3 Determining Optimal Burn-in Time Using the Dirichlet Process.- 11.4 Conclusions.- 12 Software Reliability and Infant Mortality Period of the Bathtub Curve.- 12.1 Basic Concept and Definitions.- 12.2 Stochastic Software Reliability Models.


- 12.3 The Non-stochastic Software Reliability Models.- 12.4 A Proposed Procedure of Testing Data.- 12.5 Software Reliability Management.- 12.6 Conclusions.


- Epilogue: Cost-effective Design for Stress Burn-in.- References.- Appendices.- A Notation and Nomenclature.- B Failure Modes for Parts.- C Common Probability Distributions.- C.1 Discrete Distributions.


- C.2 Continuous Distributions.- D Simulation for U-shaped Hazard Rate Curves.- D.1 Generating U-shaped Hazard Rate Curves.- D.2 Simulation.- E Sample Programs.


- E.1 A Sample GINO Program.- E.2 A Sample GAMS program.


To be able to view the table of contents for this publication then please subscribe by clicking the button below...
To be able to view the full description for this publication then please subscribe by clicking the button below...