About the Author Abbreviations 1. Process and Classification 1.1. Introduction 1.2. Role of design-specific tool 1.3. Tools in AM and other processes 1.
4. Definition of a process and AM 1.5. Steps in additive layer manufacturing (ALM) 1.6. Layerwise and non-layerwise 1.7. Machining and AM 1.
7.1. Approach 1.7.2. Generation of waste 1.7.3.
Material properties 1.8. Disadvantages of ALM 1.8.1. Staircase effect 1.8.1.
1. Removal 1.8.2. Need for support structure 1.8.3. Problem in repair 1.
9. Additive non-layer manufacturing 1.9.1. CNC accumulation 1.9.2. Continuous liquid interface production 1.
9.3. Two-photon polymerization 1.10. Summary of ALM Processes 1.11. Process differences 1.12.
Difference due to materials 1.12.1. Attempt to classify 1.13. Agents for joining materials 1.13.1.
Attempt to classify 1.14. Form of feedstock 1.14.1. Attempt to classify 1.15. Conveyance of feedstock 1.
15.1. SLM and LENS 1.15.2. Other examples 1.15.3.
Attempt to classify 1.15.3.1. No feeding category 1.15.3.2.
Feeding category 1.16. First feeding category 1.17. Second feeding category 1.18. Difference between solid and liquid deposition 1.19.
Classification due to feeding 1.20. Combined classification 1.20.1. Was the decision to combine right 1.20.2.
Slurry in the classifcation 1.21. About the book References 2. Bed Process 2.1. Classification 2.2. Powder bed process 2.
2.1. Description of classification 2.2.2. Role of heat 2.3. Laser powder bed fusion 2.
3.1. Description 2.3.2. Parameters 2.3.2.
1. Scan spacing 2.3.2.2. Scan speed 2.3.2.
3. Layer thickness 2.3.3. Repair 2.3.4. Methods for increasing fabrication rate 2.
3.4.1. Increasing layer thickness 2.3.4.2. Dividing processing area 2.
3.4.3. Optimizing process 2.3.4.4. Changing orientation 2.
3.4.5. Increasing scan speed 2.3.4.6. Adopting areawise scanning 2.
4. Electron beam powder bed fusion 2.4.1. Beam generation 2.4.2. Beam manipulation 2.
4.2.1. Focusing of beam 2.4.2.2. Beam shape control 2.
4.3. Vacuum chamber 2.4.4. Powder bed processing 2.5. EPBF and LPBF 2.
5.1. Powder 2.5.2. Beam 2.5.3.
Beam-powder interaction 2.5.4. Parameter 2.5.5. Implication of vacuum 2.5.
6. Scanning 2.6. Non-beam powder bed fusion 2.6.1. Heater based sintering 2.6.
2. Localized microwave heating based AM 2.6.3. High speed sintering 2.6.3.1.
Energy-efficiency 2.7. Linewise, pointwise, and areawise scanning 2.7.1. Linewise 2.7.2.
Pointwise 2.7.3. Areawise 2.7.4. Basic differences 2.8.
Binder jet three dimensional printing 2.8.1. Role of binder 2.9. Photopolymer bed process 2.10. Slurry bed process 2.
10.1. Binding methods 2.11. Layerless powder bed process 2.11.1. Formation of a part 2.
11.2. Why it is non-layerwise References 3. Deposition Process 3.1. Classification 3.2. Deposition mechanism 3.
2.1. Melting 3.2.2. Extrusion 3.2.3.
Deformation 3.2.4. Comparison between deformation and extrusion 3.2.5. Jetting and spraying 3.2.
6. Field force 3.3. Solid deposition 3.4. Beam solid deposition 3.4.1.
Advantages 3.4.2. Disadvantages 3.5. Laser solid deposition 3.5.1.
Types of powder deposition 3.5.1.1. Coaxial continuous 3.5.1.2.
Coaxial discrete 3.5.1.3. Off-axial 3.5.2. Laser-powder interaction 3.
5.2.1. L-beam and powder stream interacts midway 3.5.2.2. L-beam follows powder stream 3.
5.2.3. Powder stream follows l-beam 3.6. Electron beam solid deposition 3.7. Powder and wire 3.
7.1. Cost 3.7.2. Availability 3.7.3.
Material efficiency 3.7.4. Processing in vacuum 3.7.5. Oxidation 3.7.
6. Safety 3.7.7. Effect on process 3.7.8. Processing an inaccessible area 3.
8. Non-beam solid deposition 3.9. Additive friction stir deposition 3.10. Friction surfacing based AM 3.11. Cold spray AM 3.
11.1. How cold spray is generated 3.12. Arc based deposition 3.12.1. What is arc 3.
12.2. Gas tungsten arc welding based 3.12.2.1. Plasma welding based 3.12.
3. Gas metal arc welding based 3.13. Extrusion based deposition 3.13.1.1. Solid polymer feedstock type 3.
13.1.2. Layerless fused deposition modeling 3.14. Layerless deposition and layerless bed process 3.15. Comparing friction based with fusion based deposition 3.
16. Air deposition 3.17. Ion deposition 3.17.1. Electrolytic solution based 3.17.
2. Colloidal solution based 3.18. Liquid deposition 3.18.1. Water deposition 3.19.
Slurry deposition References.