Foreword xvii Preface xix 1. Overview 1 Bibliography 6 2. Fundamental Concepts 7 2.1. Maxwell''s Equations Demystified 7 2.1.1. Fundamental Terms 9 2.

1.2. Maxwell''s Equations 12 2.2. Boundary Conditions 24 2.3. Intrinsic Inductance of Conductors and Interconnects 26 2.3.

1. Concept of Inductance 27 2.3.2. Self-Inductance 27 2.3.3. Mutual Inductance 29 2.

3.4. Partial Inductance 30 2.3.5. External and Internal Inductance 37 2.3.6.

Skin Effect and Skin Depth 38 2.3.7. Proximity Effect 43 2.4. Nonideal Properties of Passive Circuit Components and Interconnects 45 2.4.1.

Resistors 46 2.4.2. Capacitors 47 2.4.3. Inductors 49 2.4.

4. Interconnects (Wires and PCB Traces) 49 2.5. Return Current Path Impedance 51 2.5.1. What Path Should Return Currents Follow? 51 2.5.

2. Equivalent Circuit Analysis 53 2.5.3. Implication of the Principle 64 2.6. Transmission Line Fundamentals 64 2.6.

1. Transmission Line Definition 65 2.6.2. Transmission Line Equations and Intrinsic Parameters 66 2.6.3. Transmission Line Termination and Loading Conditions 69 2.

7. Characteristics of Signals and Circuits 74 2.7.1. Spectral Content of Signals 75 2.7.2. Differential-Mode and Common-Mode Signals 81 2.

7.3. Common-Mode (CM) to Differential-Mode (DM) Conversion 91 2.7.4. Differential Signaling and Balanced Circuits 95 2.8. Interaction between Sources to Radiated Fields 104 2.

8.1. Radiation from Current-Carrying Conductors 104 2.8.2. Flux Cancellation, the Electromagnetics of Balancing 108 Bibliography 110 3. The Grounds for Grounding 113 3.1.

Grounding, an Introduction 113 3.1.1. "Grounding," One Term, Many Imports 113 3.1.2. Grounding--A Historical Perspective and the Evolution of the Term 118 3.1.

3. Grounding-Related Myths, Misconceptions, and Misapprehensions 120 3.2. Objectives of Grounding 123 3.2.1. Safety Grounding 126 3.2.

2. Grounding for Control of Electromagnetic Interference (EMI) 138 3.2.3. Signal Grounding 141 3.3. Grounding-Related Case Studies 148 3.3.

1. Case #1: The Grounds for Electrostatic Discharge (ESD) 148 3.3.2. Case #2: The Grounds for Lightning Protection 149 Bibliography 153 4. Fundamentals of Grounding Design 155 4.1. Ground-Coupled Interference and its Preclusion 155 4.

1.1. Grounding May Not be the Solution; Rather it Could be Part of the Problem 155 4.1.2. Controlling Common-Impedance Interference Coupling 161 4.2. Fundamental Grounding Topologies 173 4.

2.1. The Need for Different Topologies 173 4.2.2. Grounding Topologies 176 4.3. Grounding Trees 209 4.

3.1. Objectives and Basic Design Considerations 209 4.3.2. Ground Tree Design Methodology 210 4.4. Role of Switch-Mode Power Supplies in Grounding System Design 224 4.

4.1. Principle of Switch-Mode Power Supply Operation 225 4.4.2. The Need for Isolation 226 4.4.3.

Isolation and Grounding in Switch-Mode Power Supplies 229 4.5. Ground Loops 233 4.5.1. Definition of a "Ground Loop" 234 4.5.2.

Ground Loop Consequences ("Who''s Afraid of the Big Bad Loop?") 239 4.5.3. Ground-Loop Interference Coupling 241 4.5.4. Ground-Loop Interactions: Frequency Considerations in between Enclosures 257 4.5.

5. Resolving Ground-Loop Problems 264 4.6. Zoned Grounding 291 4.6.1. The Zoning Concept as Applied to Grounding 291 4.6.

2. Zoning Compromises and Violations 292 4.6.3. Impact of Zoning on Subsystem Grounding Architecture 293 4.7. Equipment Enclosure and Signal Grounding 296 4.7.

1. External Signal and Safety Grounding Interconnects between Enclosures 297 4.7.2. Equipment DC Power, Signal, and Safety Grounding 298 4.7.3. Power Distribution Grounding Schemes in Integrated Clustered Systems 301 4.

7.4. Grounding of Equipment Enclosure Shield 305 4.8. Rack and Cabinet Subsystem Grounding Architecture 308 4.8.1. Grounding Ground Rules in Racks and Cabinets 308 4.

8.2. Ground Loops and their Mitigation in Racks and Cabinets 310 4.9. Grounding Strategy Applied by System Size and Layout 314 4.9.1. "One Size Fits None" 314 4.

9.2. Isolated System 315 4.9.3. Clustered System 315 4.9.4.

Distributed System 318 4.9.5. Nested-Distributed System 319 4.9.6. Central System with Extensions 320 Bibliography 321 5. Bonding Principles 323 5.

1. Objectives of Bonding 323 5.2. Bond Impedance Requirements 327 5.3. Types of Bonds 329 5.3.1.

Direct Bonds 330 5.3.2. Indirect Bonds 335 5.3.3. Bonding Impedance and Effectiveness 337 5.4.

Surface Treatment 348 5.5. Dissimilar Metals Consideration: Corrosion Control 351 5.5.1. Electrochemical Basis of Bond Galvanic Corrosion 352 5.5.2.

Electrochemical Series 353 5.5.3. Galvanic Series 354 5.5.4. Galvanic Couples 355 5.5.

5. Corrosion Protection 360 Bibliography 369 6. Grounding for Power Distribution and Lightning Protection Systems 371 6.1. Introduction 371 6.2. Power System Earthing 372 6.2.

1. Objectives of Power System Earthing 372 6.2.2. Faults in Power Supply Systems 373 6.2.3. General Configuration of a Power Distribution System 375 6.

2.4. Electric Shock Hazards 377 6.2.5. Methods of Power System Earthing 383 6.2.6.

The Ungrounded System 385 6.3. Earthing for Low-Voltage Distribution System 387 6.3.1. TN System 388 6.3.2.

TT System 394 6.3.3. IT System 396 6.3.4. Temporary Overvoltage in Low-Voltage Installations Due to Faults between High-Voltage Systems and Earth 397 6.3.

5. Earthing Systems and EMC 402 6.3.6. Requirements for the Installation of Equipment with High Protective Earth Conductor Current 404 6.3.7. Application of Residual-Current Devices for Shock Protection 405 6.

4. Lightning Protection 408 6.4.1. An Overview of the Lightning Phenomenon 408 6.4.2. Lightning Attachment Point and Zones of Protection 409 6.

4.3. Components of the Lightning Protection System 411 6.4.4. Influence of LV Earthing Schemes on Lightning Overvoltages 416 6.5. The Earth Connection 418 6.

5.1. Resistance to Earth 419 6.5.2. Soil Resistivity 420 6.6. Types of Earth Electrodes 420 6.

6.1. The Earth Rods 422 6.6.2. Earth Plates 426 6.6.3.

Horizontal Strip or Round Conductor Electrode 427 6.6.4. The Mesh or Grid Earth Electrode 432 6.6.5. The Ring Earth Electrode 434 6.6.

6. Foundation Earth Electrode 437 6.7. Design of Earth Electrodes and their Layout 440 6.7.1. Selection of Material 440 6.7.

2. Grounding Requirements of Power Distribution Systems 441 6.7.3. Measures to Reduce Transient Impedance of Earth Electrodes 443 6.7.4. Earthing Requirements for Lightning Protection 445 6.

7.5. Earth Potential Rise and Surface Potential Gradients 447 6.8. Measurement of Soil Resistivity, Earth Electrode Resistance and Earthing System Impedance 455 6.8.1. Measurement of Soil Resistivity 455 6.

8.2. Measurement of Earth Resistance 457 6.9. Reducing Earth Resistance 462 6.10. Bonding to Building Structures 463 Bibliography 466 7. Grounding in Wiring Circuits and Cable Shields 469 7.

1. Introduction: System Interface Problems 469 7.2. To Ground or Not To Ground (Cable Shields) 470 7.3. Fundamentals of Cable Shielding 472 7.3.1.

Why Shield Cables? 472 7.3.2. Fundamental Shielding Mechanisms 473 7.3.3. Configuration of Shielded Cables 475 7.3.

4. Termination (Grounding) of Cable Shields--A Qualitative Discussion 484 7.3.5. Termination (Grounding) of Cable Shields--A Quantitative Discussion 490 7.3.6. Frequency Considerations in Cable Shield Termination 498 7.

4. Shield Surface Transfer Impedance 510 7.4.1. Methods for Cable Shielding 512 7.4.2. Shield Surface Transfer Impedance in Coaxial Lines 514 7.

4.3. Where Should a Shield of a Balanced Line be Terminated? 517 7.4.4. Shield Termination--The Key to Optimal Shielding Performance 523 7.4.5.

Twisted Cables and the Effect of Grounding 545 7.4.6. Strategies for Shield Termination in Common Types of Shielded Cables 550 7.5. Grounding Considerations in Signal Interfaces 557 7.5.1.

Interfacing of Low-Frequency Unbalanced Signal Circuits 557 7.5.2. Interfacing of High-Frequency Unbalanced Signal Circuits 559 7.5.3. Interfacing of Equipment Containing Both Low- and High-Frequency Signals 559 7.5.

4. Interfacing of Broadband (Video) Signal Circuits 561 7.5.5. Interfacing of Balanced Signal Circuits 562 7.5.6. Effect of Interface Scheme on Magnetic Interference Susceptibility 566 7.

6. Grounding of Transducers and Measurement Instrumentation Systems 569 7.6.1. Measurement Accuracy Concerns 571 7.6.2. Guard Shields and Instrumentation Wiring Shield Interconnection 574 7.

6.3. Grounding of Wiring Shields in Analog-Data Acquisition Systems 557 Bibliography 586 8. Grounding of EMI Terminal Protection Devices 589 8.1. Filtering and Transient-Voltage Suppression--Complementary Techniques to Shielding 589 8.2. Types of Conducted Noise 590 8.

3. Overview of Filtering and Transient Voltage Suppression 590 8.3.1. Fundamental EMI Filter Devices and Circuits 590<.