PART I: Introduction PRINTED CIRCUITS Technology Presentation Inner-Layer Processing Materials Preparation Lamination Drilling Making the Hole Conductive Imaging Electroplating Copper Etching Solder Masking Surface Finishing Routing Testing and Inspection Assembling PROBLEM SOLVING FOR RELIABILITY AND QUALITY Conventional Paradigms Complexity and Time Frames Quasilinearity, Circularity, and Closure Advance of Reliability Paradigms PART II: Evolvable Designs of Experiments (EDOE) POLYSTOCHASTIC MODELS What is PSM? Basic Notions for Categorical Frame Illustrative Examples of PSM and Categorical Frames FIRST-ORDER WAVE EQUATION Algebraic Frames for Time "T" and Space "Z" The First-Order Wave Equation "Kinetic" Model: Walsh-Hadamard Matrices "Convection" Model: Latin Squares Spectral Analysis: Correlation INFORMATIONAL ANALYSIS: EDOE MATRICES Walsh-Hadamard Matrices and Latin Square Designs Classification Procedures: Informational Criteria Informational Entropy and Distances Adaptability in Classification Informational Results Relation with Thermodynamics Ranking, Discarding, and Replication of the Columns Lumping and Splitting Columns Juxtaposing and Cutting Tables of DOE Matrices EDOE METHODOLOGY Scientific and Engineering Methods Center Design and Hierarchy Recursivity and Focusing Problem-Solving Framework for PCB Quality Forward and Backward Search Interactions: Dissociation - Integration EDOE Basic Steps EDOE Frame and SKUP Schema Comparison of EDOE with other Methods PART III: Case Studies SOLDER WICKING Illustrative Failure Analysis Illustrative EDOE Frame SKUP Schema for Solder Wicking RELIABILITY ANALYSIS EDOE for Reliability SKUP Schema for Reliability Reliability Management Systems: Main Elements Reliability Prediction Software Minicoupons Reliability Analysis IST Electrical Resistance Analysis DRILLING Drilling Quality Framework Test Coupons Testing Small Plated Through Holes: SKUP Schema for Drilling Reliability Tests Lifetime Maps Drilling Quality Evaluations Testing the Design, D Testing for Processing, P Reliability Evaluations SURFACE FINISH SOLDERABILITY Finish Solderability Frame SKUP Schema for Surface Finish DIRECT PLATE Direct Plate Reliability Microsectioning Results Electrical Resistance versus the Number of Cycles Classification Method Associated Vectors-Grids First Step of Classification Second Step of Classification IST Lifetime and Electroplated Cu Thickness Summary SKUP Schema for Direct Plate PLATING VOIDS Plating Voids Type The SKUP Schema for Plating Voids PART IV: Evolvability SELF-ADAPTIVE CIRCUITS Evolvability Levels Self-Adaptivity Self-Adaptive Designs and Constructions Self-Adaptive Materials Self-Adaptive Processing Self-Adaptability to Testing and Field Conditions PROACTIVE CIRCUITS Proactiveness for Circuit Evolutionary Hardware Electrochemical Filament Circuits EVOLVABLE CIRCUITS Evolvability Challenges Molecular Electronics Bacteriorhodopsin for Optoelectronic Circuitry Embedded Symbolic-Connectionists Hybrids Temporal Synchrony for Embedded Symbolic-Connectionist Hybrids Embedded EDOE Hybrid Controlled Microfluidic Circuits Reconfigurable Microfluidic Circuits Self-Constructed Molecular Circuits and Computing Genetic Code-Like Mechanism for Molecular Circuitry Conventional Circuits versus Evolvable Circuits EVOLVABLE MANUFACTURING SYSTEMS Manufacturing Paradigms Fractal Manufacturing System Holonic Manufacturing System Biologic Manufacturing System Virtual Manufacturing System SKUP Schema for Virtual Manufacturing Systems Multiagent Manufacturing Systems: Architecture Muiltiagent-Based Versus Conventional Manufacturing Systems PART V: Concluding Remarks RELATED CONCEPTS Complexity Evolvability Polystochastic Method Constructivism Cybernetics and the Cycle of Sciences.