YongAn Huang received his Ph.D. degree in engineering mechanics from Northwestern Polytechnical University, Xi'an, China, in 2007. Currently, he is a Professor of Mechanical Engineering at Huazhong University of Science and Technology, the Vice Director of State Key Laboratory of Digital Manufacturing Equipment and Technology, and a winner of the National Science Fund for Distinguished Young Scholars. His research interests include the design and manufacturing for flexible electronics, curved electronics, printed display, and metamaterials. By now, he has published 3 monographs and more than 120 papers in international peer-reviewed journals like Science Advances, Advanced Materials, Advanced Functional Materials, Nature Communications, etc. Yewang Su received his Ph.D.
degree in engineering mechanics from Tsinghua University, Beijing, China, in 2011. Currently, he is a Professor in State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing, China, a winner of the National Youth Top-notch Talent Support Program, and a winner of the Hundred Talent Program in Chinese Academy of Sciences. His research interests focus on the mechanics of flexible structures and devices. By now, he has published more than 80 papers in international peer-reviewed journals like Journal of the Mechanics and Physics of Solids, Nature Communications, PNAS, Advanced Materials, etc. Shan Jiang received his Ph.D. degree in solid mechanics from the Huazhong University of Science and Technology (HUST), Wuhan, China, in 2018. He currently is a Postdoctoral Researcher at State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST and a winner of the Young Scientists Fund of the National Natural Science Foundation of China.
His research interests focus on the interdisciplinary research of flexible electronics and metamaterials. By now, he has published about 20 papers in international peer-reviewed journals like Advanced Materials, Advanced Functional Materials, ACS Applied Materials & Interfaces, Composite Structures, etc.