A comprehensive, practical resource on state-of-the-art cosmetic dermatology procedures Volume II of Procedural Dermatology: Postresidency and Fellowship Compendium, edited by esteemed dermatologists Yoon-Soo Cindy Bae and David H. Ciocon, provides a comprehensive review of minimally invasive and noninvasive procedures to treat a wide range of cosmetic issues and conditions. Twenty-four consistently organized chapters cover the most up-to-date developments in cosmetic dermatology. Topics include ablative and nonablative resurfacing; body contouring; tissue tightening; laser treatment for vascular and pigmented lesions; scar, acne, and tattoo removal; the use of neuromodulators; soft tissue fillers; hair removal and restoration techniques; blepharoplasty; treatment options for axillary hyperhidrosis; thread lifts; liposuction; and fat transfers. Key features: Reflects the collective wisdom of dermatology thought leaders and innovators who pioneered the majority of current laser and cosmetic treatments Incorporates a patient-centered approach tailored to individual needs, concerns, ethnicity, anatomy, skin type, and functional status Firsthand pearls and pitfall prevention strategies throughout the text focus on improving patient outcomes Procedural videos demonstrate chemical peels and high-definition body contouring techniques This practical book provides early-career dermatologists with expert guidance that enriches their existing cosmetic dermatology skills and inspires learning and incorporating new techniques into practice to optimize patient care. Also available: Ciocon/Bae, Procedural Dermatology Volume I: Reconstruction, Postresidency and Fellowship Compendium; Thieme, 2023; 978-3-13-242405-0 (print), 978-3-13-258256-9 (e-book). This print book includes complimentary access to a digital copy on https://medone.thieme.

com. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.